IGBT驱动电路布线设计注意事项

驱动布线设计注意事项

1.The layout must minimize the parasit inductance between the driver’s output stage and the . This corresponds to keeg the loop area assmall as possible showed in the following Figure.  

2. Care must be taken to avoid coupling of noise between the power circuit and the control circuit. This be aomplished by proper placement ofthe gate drive board and/or shiing the gate drive circuit.
3. It is recommended to use the auxiliary tter terminal for connecting the gate drive.

4. If direct connection of the drive to the IGBT control terminals is not possible, the use of twisted pair (3 turns per inch of minimum length) or strip line is recommended.

5. Gate protection clamp must also have low inductance layout and must be ated as close as possible to the gate-emitter control terminals of the IGBT module.

6. Do not route printed circuit board traces near each other that are subjected to mutual potential changes due to IGBT switching. High dv/dtcan couple noise through parasitic caitances. If crossing or parallel routing of those traces is unavoidable, use shield layers in between.

7. Parasitic capacitance between high side gate drive circuits, high and low side gate drive circuits and control circuits may cause probl with coup noise. Power supply transformer inter-winding capacitance can be another source of coupled noise. Appropriate measures to reduce these parasitic capacitances have to be implemented.

8. If opt-couplers are used for isolation of the high side gate drive signals they should have a minimum common mode transient immunity of 10,000 V/μs.